GE Fanuc IC670GBI002 Field Control Series Genius Bus Interface Unit
Configured for distributed intelligent communication in Field Control I/O System platforms, the GE Fanuc IC670GBI002 (IC670GBI002 Genius Bus Interface Unit) provides direct physical/electrical execution. The module operates as the primary gateway interfacing local I/O modules with the central Genius Bus network, establishing data exchange across distances up to 7500 feet. It delivers internal logic power conversion to stabilize the station backplane while maintaining electrical isolation between field circuitry and the communications link.
Hardware Specifications
| Parameter | Specification |
| Model | IC670GBI002 |
| Brand | GE Fanuc |
| Origin | USA |
| Weight | 0.68 kg |
| Dimensions | Standard Field Control BIU footprint |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 115 VAC / 125 VDC nominal input |
| Input Voltage Range | 90-135 VAC / 105-150 VDC |
| Internal Logic Output | 6.5 VDC +/-5% at 1.4 A |
| Network Protocol | Genius Bus (153.6 Kbps standard) |
| Inrush Current | 15-50 A peak (3 ms maximum) |
| Holdup Time | 10 ms minimum |
| I/O Capacity | Up to 8 local Field Control I/O modules |
Backplane Bus Communication Velocity and Deterministic Networks
The IC670GBI002 executes deterministic communication over the Genius Bus network at a standard transmission rate of 153.6 Kbps. The internal backplane bus architecture manages high-velocity data transfer between the gateway logic and up to 8 connected I/O modules. This local bus structure offloads cyclic I/O scanning processing routines from the central processing unit. The deterministic network configuration ensures predictable packet delivery times across the serial bus, sustaining synchronization between remote field signals and the host controller interface without communication collision or variable latency.
Frequently Asked Questions
Q: What are the restrictions regarding the hot-swapping functionality on the IC670GBI002 station?
A: The IC670GBI002 supports the hot insertion and removal of expansion I/O modules on the local backplane while powered. However, the BIU gateway module itself must be de-energized before disconnection from the network or baseplate to prevent bus disruption or transient electrical damage.
Q: How does the module handle temporary input voltage drops without interrupting backplane power?
A: The internal power supply stage incorporates a hardware holdup circuit that maintains stable 6.5 VDC logic power for a minimum of 10 ms during input voltage dips, ensuring continuity of local operations during routine power disturbances.
Q: Does the module require separate grounding lines for the network shield and the chassis?
A: Yes. The Genius Bus network shield must be continuous and grounded at one end only, typically at the bus controller. The IC670GBI002 chassis requires a direct low-impedance physical bond to earth via a conductive DIN rail or a dedicated ground lug to mitigate common-mode noise.
Field Installation Guidelines
- Mounting and Grounding: Mount the module vertically on a standard 35 mm DIN rail. The DIN rail must possess a conductive, non-anodized finish to establish a reliable low-impedance chassis ground path through the integrated mounting clips.
- Wiring Separation: Route high-voltage AC/DC power supply lines (115 VAC / 125 VDC) through separate wire ducts away from the low-voltage Genius Bus serial communication cables to eliminate electromagnetic cross-talk.
- Terminal Torque: Secure all terminal block electrical connections to the specified torque rating to prevent resistive heating and intermittent power loss under vibration conditions.
- Airflow Clearance: Maintain a minimum clear space of 50 mm above, below, and adjacent to the module housing to allow passive thermal dissipation and prevent internal component overheating within the enclosure.
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