Product Overview

The Emerson GE Fanuc IC694ACC310 serves as a mechanical blank slot filler module for the PACSystems RX3i programmable logic controller (PLC) series. This passive component contains no active integrated circuitry, internal logic solvers, or current-consuming components. Instead, it serves as a structural barrier that blocks airborne contaminants from settling onto exposed backplane ports while maintaining optimal cooling dynamics within high-density control cabinets. Process plant builders deploy this module inside empty baseplate slots to preserve original equipment manufacturer (OEM) thermal parameters and eliminate structural vulnerability in hazardous operational sectors.

Technical Specifications

• Manufacturer: GE Fanuc / Emerson

• Model Number: IC694ACC310

• Product Line: PACSystems RX3i

• Functional Module Type: Blank Slot Filler / Protective Slot Cover

• Baseplate Interactivity Compatibility: All RX3i Universal Baseplates (7, 12, and 16-slot configurations) and Expansion Baseplates (5 and 10-slot variations)

• Electrical Current Draw Parameters: 0 mA (Passive component absorbs no electrical power from the chassis backplane)

• Physical Chassis Footprint: Occupies exactly 1 standard RX3i baseplate hardware slot

• Live Replacement Capability: Supports full hot-swap operations (Technicians can insert or extract the module while the chassis runs live under full system power)

• Structural Base Material Construction: Industrial-grade molded high-impact composite polymer

• Operating Temperature Bounds: 0 to +60 degrees Celsius (32 to 140 degrees Fahrenheit)

• Storage Temperature Limits: -40 to +85 degrees Celsius

• Product Component Weight: 0.11 KG (0.25 lbs)

• Compliance Environmental Certifications: UL listed, CE compliant, and Class I Division 2 hazardous location approved

• System Lifecycle Status: 100% Brand New and Original in Factory Packing

Engineering Advantages

Directs Airflow Pathways to Eliminate Thermal Derating

Leaving open gaps in an active RX3i chassis disrupts standard convection paths. Internal cabinet fan systems push air through the path of least resistance, allowing cool air to bypass high-density I/O modules and hot CPU cards by rushing through empty slots. Installing the IC694ACC310 seals these physical openings completely. The solid composite body forces cooling currents to route directly across the heat sinks of neighboring active modules, lowering localized operational temperatures and preventing thermal system derating during high-load processing blocks.

Shields Exposed Copper Contacts from Conductive Pollution

Industrial control panels operating in milling, mining, or water treatment facilities face continuous exposure to airborne moisture, carbon dust, and loose metallic trimmings. The IC694ACC310 snaps firmly into place over the bare backplane multi-pin array to isolate the copper pins from the ambient environment. This continuous mechanical seal prevents debris accumulation and eliminates the risk of tracking faults or short circuits between adjacent pins, preserving backplane bus communication tracking.

Toolless Snap-In Anchorage Slashes Installation Time

The molded composite housing features an integrated retention mechanism that mirrors the physical framework of active RX3i modules. System builders slide the filler card directly into the alignment tracks of any empty universal or expansion baseplate slot without needing screwdrivers or specialized mounting hardware. The top and bottom latches click securely onto the rack frame to resist continuous low-frequency vibrations from nearby industrial compressors, ensuring the shield remains fixed through multi-year operational cycles.

FAQs

• Does the installation or removal of the IC694ACC310 require a complete system power shutdown? No. The module features a completely passive electrical footprint and touches no backplane communication lines. Technicians can snap this filler block into empty slots or extract it during live operations without interrupting active PLC logic, disrupting neighboring I/O processing channels, or generating electrical noise on the shared backplane bus.

• Can this slot cover fit into older GE Fanuc Series 90-30 PLC racks? The IC694ACC310 shares certain structural characteristics with older series components, but HIMA and Emerson engineer the RX3i mechanical tolerances to match the tracking parameters of the PACSystems RX3i Universal Baseplates precisely. Check your specific rack alignment rails; while the module covers the physical width, it delivers optimal airflow redirection only when locked into native RX3i chassis slots.

• How many filler modules does a system require during panel assembly? You must install one IC694ACC310 module into every empty, unutilized slot on your RX3i baseplate. Leaving even a single slot uncovered allows cooling air to vent improperly and creates an entry point for conductive particulate matter, undermining the environmental integrity of the entire rack assembly.