The Schneider TSX-MAP-1074, also cataloged as the TSXMAP1074 Modbus Plus Communication Adapter, operates as a dedicated hardware component for MAPWAY data link interface management within Modicon TSX Micro PLC systems. The hardware establishes communication synchronization parameters over high-speed networks, allowing the host controller to exchange variables, logic interlocks, and supervisory frames across peer-to-peer or multi-drop architectures. Execution of network physical layers is managed by localized co-processing chips embedded on the plug-in board assembly.
| Parameter | Specification |
|---|---|
| Model | TSX-MAP-1074 |
| Brand | Schneider Electric |
| Origin | France |
| Weight | 0.30 kg (0.66 lbs) net weight / 1.14 kg (2.51 lbs) shipping weight |
| Dimensions | 120 mm x 40 mm x 90 mm |
| Operating Temp | 0 to 60 deg C |
| Storage Temp | -40 to +85 deg C |
| Power Consumption | Derived from TSX Micro backplane power rails |
| Network Type | Modbus Plus / MAPWAY |
| Communication Speed | 1 Mbps |
| Communication Ports | 1 x Modbus Plus network connector |
| Network Topology | Peer-to-peer, multi-drop |
| Node Capacity | Up to 64 nodes per network segment |
| Diagnostics | Dedicated LED array for network activity and module status |
| Protection Class | IP20 |
| Certifications | CE, UL, CSA |
The Schneider TSX-MAP-1074 functions inside the modular assembly by translating system variables across the interior architecture under backplane bus communication velocity licenses. Data traffic handling runs deterministically at 1 Mbps using a token-passing mechanism, preventing data collisions across the continuous multi-drop routing path.
When aligning historical networks with modern Profinet / EtherNet/IP deterministic networks via external system bridges, the interface preserves the integrity of localized data packets. This structure supports precise I/O density scaling profiles up to 64 nodes, guaranteeing that high-frequency registry polling sequences maintain sub-millisecond repeatability criteria without degrading internal processing memory buffers.
Q: Can the TSX-MAP-1074 module be extracted or inserted into the rack slot while backplane power is active?
A: No. The TSX Micro slot architecture does not feature live insertion protection circuitry. Performing hot-swap actions can generate destructive transient voltage spikes across the data pins, risking physical failure of the internal communication processors.
Q: How does the network logic respond if two nodes are assigned identical addresses on the same segment?
A: Address duplication induces token errors and drops the duplicate nodes offline. The status diagnostics will display error indicators, and communication processing across the affected hardware terminals will be suspended until the rotary address parameters are corrected.
Q: Does this hardware configuration support direct connectivity to Modicon Quantum or M580 backplanes?
A: No. The physical connector spacing and bus line pins are engineered strictly for the Modicon TSX Micro hardware platform. It cannot be inserted or operated inside Quantum or X80 chassis configurations.
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