6ES7153-2BA02-0XB0 Siemens ET 200M Interface Module

6ES7153-2BA02-0XB0 Siemens ET 200M Interface Module | New Stock

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SIEMENS 6ES7153-2BA02-0XB0 SIMATIC PLC INTERFACE MODULE The SIEMENS 6ES7153-2BA02-0XB0, also cataloged as the IM 153-2 DP HF ET 200M Interface...

SKU: 6ES7153-2BA02-0XB0

Manufacturer: Siemens
Product No.: 6ES7153-2BA02-0XB0
Product Type: Digital I/O Cards
Product Origin: Germany
Payment:T/T, Western Union
Weight: 360g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

SIEMENS 6ES7153-2BA02-0XB0 SIMATIC PLC INTERFACE MODULE

The SIEMENS 6ES7153-2BA02-0XB0, also cataloged as the IM 153-2 DP HF ET 200M Interface Module, operates as a dedicated hardware component for discrete data routing and subsystem electrical distribution within SIMATIC distributed I/O networks. The module establishes the primary physical and logical bridge between the central controller and up to 12 S7-300 expansion modules via the PROFIBUS DP fieldbus architecture. By executing high-speed, deterministic cyclical exchange of I/O image tables, the assembly Offloads localized network transactions from central CPU execution loops.

Hardware Specifications

Parameter	Specification
Model	6ES7153-2BA02-0XB0
Brand	Siemens
Origin	Germany
Weight	0.36 kg
Dimensions	40 x 125 x 117 mm
Operating Temp	0 to 60 deg C
Power Consumption	5.5 W typical power loss
Supply Voltage	24 VDC (nominal range 20.4 to 28.8 VDC)
Input Current Consumption	Max. 600 mA
Backplane Output Voltage	5 VDC
Backplane Output Current	Max. 1.5 A
Module Capacity	Up to 12 S7-300 modules max
Address Space Volume	244 bytes input / 244 bytes output
Physical Layer Protocol	PROFIBUS DP (RS-485 format)
Transmission Velocity Rates	Up to 12 Mbit/s
Vendor Identification (VendorID)	801Eh
Protection Class	IP20
Isolation Voltage Rating	500 V

Backplane Bus Communication and Network Velocity Profiles

The device incorporates specific internal backplane bus communication velocity licenses that handle dense payload profiles across distributed ET 200M assemblies. It coordinates up to 128 time-stamped digital inputs per station with a resolution accuracy threshold down to 1 ms across ≤8 modules, shifting to 10 ms when handling the full 12-module expansion limit. The underlying hardware firmware flash compatibility allows concurrent routing of expanded quantity structures for HART auxiliary variables and direct slave-to-slave data exchange via deterministic PROFIBUS networks, supporting the integration of 64-channel high-density modules at a fixed density mapping of 32 signals per physical rack slot.

Frequently Asked Questions

Q: How does the 6ES7153-2BA02-0XB0 handle active failover transitions inside a redundant PROFIBUS DP topology?

A: The module contains dedicated hardware switching logic that monitors the status of twin-line connections when paired with an identical interface node on a redundant bus module assembly. If the primary master drops carrier frequency, the standby module executes a zero-bounce, bump-free switchover that maintains the active backplane state without altering current I/O positions.

Q: What are the backplane current constraints when deploying the maximum limit of twelve S7-300 modules?

A: The module internal logic regulates incoming 24 VDC down to a 5 VDC plane to supply the internal backplane logic with a maximum current ceiling of 1.5 A. If the cumulative power draw of the connected logic cards exceeds 1.5 A, external isolation components or auxiliary supply clamps must be introduced to prevent thermal overload shutdowns.

Q: Is this older High Feature hardware revision compatible with modern STEP 7 configuration suites?

A: Yes. The module is fully defined within standard Siemens engineering software utilities using GSD reference file SI04801.GSG. It can be integrated into replacement branches without requiring manual firmware modifications, provided the target master configuration respects the standard address constraints.

Field Installation Guidelines

Snaps securely onto standard S7-300 or active bus module rails; verify the rear ground slide makes solid contact with the metal rack assembly.
Set the binary station node address clearly via the front-facing DIP switch bank (range 1 to 125) before energizing the 24 VDC input lines.
Fasten incoming PROFIBUS network lines using sub-D connectors fitted with internal, low-impedance termination resistors at the end nodes.
Route the internal 24 VDC power feed lines through separate panel tracking channels to avoid cross-talk induction with adjacent signaling paths.
Maintain free air clearance margins above and below the module enclosure to preserve the standard convective heat gradient at higher installation altitudes up to 3,000 m.

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